Study of silver diffusion in silicon carbide

Diffusion of silver in 6H-SiC and polycrystalline CVD-SiC was investigated using α-particle channeling spectroscopy and electron microscopy. Fluences of 2 × 1016 cm-2 of 109Ag+ were implanted with an energy of 360 keV at room temperature, at 350 °C and 600 °C, producing an atomic density of approximately 2% at the projected range of about 110 nm. The broadening of the implantation profile and the loss of silver through the front surface during vacuum annealing at temperatures up to 1600 °C was determined. Fairly strong silver diffusion was observed after an initial 10 h annealing period at 1300 °C in both polycrystalline and single crystalline SiC, which is mainly due to implant induced radiation damage. After further annealing at this temperature no additional diffusion took place in the 6H-SiC samples, while it was considerably reduced in the CVD-SiC. The latter was obviously due to grain boundary diffusion and could be described by the Fick diffusion equation. Isochronal annealing of CVD-SiC up to 1400 °C exhibited an Arrhenius type temperature dependence, from which a frequency factor Do ∼ 4 × 10-12 m2 s-1 and an activation energy Ea ∼ 4 × 10-19 J could be extracted. Annealing of 6H-SiC above 1400 °C shifted the silver profile without any broadening towards the surface, where most of the silver was released at 1600 °C. Electron microscopy revealed that this process was accompanied by significant re-structuring of the surface region. An upper limit of D < 10-21 m2 s-1 was estimated for 6H-SiC at 1300 °C. © 2009 Elsevier B.V. All rights reserved.