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Publication Details
AFRICAN RESEARCH NEXUS
SHINING A SPOTLIGHT ON AFRICAN RESEARCH
engineering
Characterization of PCB Embedded Package Materials for SiC MOSFETs
IEEE Transactions on Components, Packaging and Manufacturing Technology, Volume 9, No. 6, Article 8666143, Year 2019
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Description
In this paper, a novel fan-out panel-level printed circuit board (PCB) embedded package technology for silicon carbide (SiC) MOSFET power module is presented to address parasitic inductances, heat dissipation, and reliability issues that are inherent with aluminum wires used in conventional packaging scheme. To withstand high temperature beyond 175 °C and high voltage over 1.2 kV and improve thermomechanical reliability of the fan-out panel-level PCB embedded SiC power module, bismaleimide-triazine (BT) laminate and prepreg with high-temperature stability, high dielectric strength, coefficient of thermal expansion (CTE) matching with SiC, and high T-g are selected as PCB embedded package materials. Then, high-temperature stabilities, dielectric breakdown strength, and thermomechanical performances of the embedded materials are characterized. The experimental results show that the PCB embedded materials can withstand high temperature beyond 200 °C and a high voltage above 1.2 kV. T-g is as high as over 260 °C, and CTE is matching with SiC. Besides, in order to provide one guideline for the high-temperature and high-pressure laminating process during the PCB embedded SiC MOSFETs packaging, cure kinetics of BT prepreg are analyzed. The results show that 1-h curing time at 280 °C curing temperature and 2-h curing time at 210 °C curing temperature can ensure the full cure of the BT prepreg. © 2011-2012 IEEE.
Authors & Co-Authors
Cao, Liqiang
China, Beijing
Chinese Academy of Sciences
Zhang, Guoqi
Netherlands, Delft
Delft University of Technology
Ferreira, Jan Abraham
Netherlands, Delft
Delft University of Technology
Statistics
Citations: 17
Authors: 3
Affiliations: 2
Identifiers
Doi:
10.1109/TCPMT.2019.2904533
ISSN:
21563950
Study Design
Case-Control Study