Interfacial thermal resistance and the solidification behavior of the Al/SiCp composites

The objective of this investigation is to study the effects of applied pressure on the solidification time and interfacial thermal resistance of A356/10% SiCp during squeeze casting. Samples were prepared for various but constant squeeze pressures up to 130 MPa while maintaining the melt and mold temperatures at 800°C and 400°C, respectively. It was observed that the solidification time was 60 s when no squeeze pressure was applied but it decreased to 42 s when the squeeze pressure was maintained at 130 MPa. The results also showed that the cooling rate increased with squeeze pressure. The solidification time calculated from one-dimensional heat flow theory was found to be close to that obtained from the experimental cooling curves. The interfacial thermal resistance between the mold and the casting was calculated and it decreases when the squeeze pressure increases. © 2015