Double-sided liquid cooling for power semiconductor devices using embedded power packaging

This paper presents a double-sided liquid cooling scheme for power MOSFETs using Embedded Power packaging technology. A liquid module test bed has been built to create various convection conditions and is used with 600-V high-current MOSFET-based Embedded Power samples to test the effectiveness and feasibility of the proposed scheme. Compared with single-sided liquid cooling, an improvement of 45% to 60% in thermal resistance is experimentally shown, for Embedded Power with double-sided liquid cooling for a device loss between 5 and 300 W and 0.25 to 4.5 GPM water flow rate. The trend and concept is also validated with physics-based lumped parameter thermal models. © 2008 IEEE.